Twin Pack Electronic Thermal Conductive Silicone Polyurethnae Epoxy Potting Material
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Twin Pack Electronic Thermal Conductive Silicone Polyurethnae Epoxy Potting Material

Twin Pack Electronic Thermal Conductive Silicone Polyurethnae Epoxy Potting Material

Two Component Polyurethane Potting Sealant for Electronic 2-part PU potting sealant SP297SP291LV (Low viscosity) SP297 i
Basic Info
Model NO. SP297
Material Polyurethane
Classification Room Curing
Main Agent Composition Polyurethane
Characteristic Weatherability
Promoter Composition Curing Agent
Composition Polyurethane
Color Black
Transport Package 25kg/Pail
Specification A: B=100: 15
Trademark SEPNA
Origin China
HS Code 3506100090
Production Capacity 100000PCS/Year
Product Description

Twin Pack Electronic Thermal Conductive Silicone Polyurethnae Epoxy Potting Material


Two Component Polyurethane Potting Sealant for Electronic

Product Description

2-part PU potting sealant

SP297SP291LV (Low viscosity)

SP297 is a solvent-free, high-performance two-component polyurethane encapsulant. The resin part (component A) contains hydroxyl groups, and the curing agent (component B) is based on isocyanate. After mixing A and B, it is cured to form an elastomer. The volume did not change significantly. It can be cured between 15-65 degrees without bubbles, high volume resistivity, flame retardant grade UL94 V-0 and other characteristics.

SPECIAL CHARACTERISTICS

  • High Performance
  • Excellent Chemical Resistance
  • Excellent Electrical Properties
  • UL91 V-0
  • Super Volume Resistivity
  • Shore A 85
  • Excellent Thermal Conductivity

APPLICATION EXAMPLES

  • 1. Filling coating casting, metal and plastic bonding well; 2. Casting of communication supplies, transformers, electrical and electronic equipment; 3. Filling and sealing of charging pile
Specification Data Sheet
PROPERTYSTANDARDUNITSVALUE-SP297
Component---Part APart B
AppearanceVisual Black liquidDark brown liquid
ViscosityGB/T 10247-2008mPa.s7500±1500 200±50
DensityGB/T 13354-92g/cm^31.5±0.051.2±0.05
Data details after mixing
Mixture ratio -Mass ratioA:B=100:15
Mixing viscosityGB/T 10247-2008mPa.s2000±500
Solid contentGB-T 2793-1995%>99
Operation time after mixingGB/T 10247-2008min25±5
Tack free time Min 25ºC/50%50±10
Gel timeGB/T 10247-2008Min 25ºC/50% 40
Curing speedGB/T 10247-2008100g (plastic cup) /65 ºC30min
HardnessGB/T 531.1-2008Shore A85±5
Tensile strengthGB/T 528-2009Mpa>4
Flame retardant gradeANSI/UL-94-1985UL94V-0
Thermal conductivity GB/T 10297-1998W/m.k0.64
Elongation at breakGB/T 528-2009 >%≥60
CTI valueGB/T 4207-2012-≥600
Dielectric strengthGB/T 1693-2007kV / mm> 20
Dielectric constantGB/T 1693-2007-4.64
Dielectric loss coefficient 100kHzGB/T 1693-2007100kHz0.1
Volume resistivityGB/T 1692-92Ω • cm3.7 ×1015
Water absorption GB/T 8810-200524h, 25 ºC,%24h/23ºC 0.12%
10d/23ºC 0.21%
0.5h/100ºC 0.09%
Application temperature GB/T 8810-2005ºC-50-150ºC
Company information

Twin Pack Electronic Thermal Conductive Silicone Polyurethnae Epoxy Potting Material


Shanghai Sepna Chemical Technology is special for Polyurethane sealant MS polymer adhesive sealant for automotive glass, bus, and construction joint sealing, bonding. We have been 10+ years in this industry, acquired Switzerland PUNADE in 2005, as the leader of odorless technology in China. With Suzhou, Shanghai has two R&D bases.At the same time. we have established an excellent sales service team and cooperated with the leading industry of VW, Volvo, Mercedes, Brilliance, Etc. Sepna's products have been widely used in the international market, mainly in North America, South America, Asia, Southeast Asia Middle East and Oceania, etc. Until now, she has serviced nearly 1000 enterprises all over the world.
Our products

APPLICATION SOLUTIONS:
1. Windshield sealant- SP86x2. Automotive adhesive sealant- -PU structural adhesive -MS adhesive sealant3. Electronic potting sealant4. Powder coating sealant5. Window & Door corner adhesive6. Waterproofing coating7. Expansion joint sealant - Self-leveling sealant - Paste sealant
Global Market

Twin Pack Electronic Thermal Conductive Silicone Polyurethnae Epoxy Potting Material

Our products

Twin Pack Electronic Thermal Conductive Silicone Polyurethnae Epoxy Potting Material

Part A: 25kg/pail
Part B: 6kg/pail
Mixing ratio: 100:15 by weight

Certificates

Twin Pack Electronic Thermal Conductive Silicone Polyurethnae Epoxy Potting Material

FAQ

1.Delivery time ? Normally, delivery time of sample order is 3 to 7 days, standard order is 7-20 days.2.How to get free samples ? Contact with us to get free samples3.How to be Sepna's distributor ? As the growing of Sepna's global business,we need to find more and more distributors and agents worldwide. Sepna will provide the best solution and service for our partners. For more information, pls contact with us directly4.Any OEM/ODM service ? Sepna can offer the customer OEM label service,and will give the protection of the your right in your market.